ALEXANDRIA, Va., June 4 -- United States Patent no. 12,324,098, issued on June 3, was assigned to Murata Manufacturing Co. Ltd. (Kyoto-fu, Japan).
"Connection structure and connection structure manufacturing method" was invented by Yuma Otsuka (Nagaokakyo, Japan) and Sho Fujita (Nagaokakyo, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A connection structure includes a first substrate having first and second principal surfaces opposed to each other and includes a first thermoplastic resin; a first substrate electrode on the first principal surface; a second substrate which has a third principal surface and a fourth principal surface opposed to the third principal surface and facing the first principal...