US Patent Issued to MURATA MANUFACTURING on June 23 for "Ceramic electronic component with carrier substrate, mounting structure of ceramic electronic component, and electronic component array" (Japanese Inventor)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,665,133, issued on June 23, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan).

"Ceramic electronic component with carrier substrate, mounting structure of ceramic electronic component, and electronic component array" was invented by Kosuke Onishi (Nagaokakyo, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A ceramic electronic component with a carrier substrate includes a ceramic electronic component including first and second principal surfaces, first and second end surfaces, first and second side surfaces, and at least two external electrodes on an outer surface of the ceramic electronic component, and a carrier substrate attached to t...