US Patent Issued to MURATA MANUFACTURING on July 7 for "Composite substrate and acoustic wave device" (Japanese Inventor)

ALEXANDRIA, Va., July 7 -- United States Patent no. 12,676,588, issued on July 7, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan).

"Composite substrate and acoustic wave device" was invented by Hideki Iwamoto (Nagaokakyo, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A composite substrate includes a support substrate made of Si, a high acoustic velocity material layer, a low acoustic velocity film, and a piezoelectric layer. In Euler angles (Phi, Theta, Psi) of the Si, Phi and Theta are within regions indicated by hatching with slant lines in FIG. 4. An acoustic wave device includes an IDT electrode in contact with the piezoelectric layer of the composite substrate."

The patent was filed...