US Patent Issued to MURATA MANUFACTURING on July 28 for "High frequency module and communication device" (Japanese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,695,472, issued on July 28, was assigned to MURATA MANUFACTURING Co. LTD. (Nagaokakyo, Japan).

"High frequency module and communication device" was invented by Keisuke Arima (Nagaokakyo, Japan), Kazuma Sugiura (Nagaokakyo, Japan) and Hiroaki Takaoka (Nagaokakyo, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A high frequency module includes a low noise amplifier, a switch, a first inductor, a second inductor, a first filter, and a second filter. The first inductor is connected between the low noise amplifier and an output terminal of the switch. The second inductor is connected between a path between the first inductor and the output terminal of t...