ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,537,554, issued on Jan. 27, was assigned to MURATA MANUFACTURING Co. LTD. (Nagaokakyo, Japan).
"Radio frequency module and communication device" was invented by Kiyoshi Aikawa (Nagaokakyo, Japan), Takanori Uejima (Nagaokakyo, Japan), Hiromichi Kitajima (Nagaokakyo, Japan), Takashi Yamada (Nagaokakyo, Japan) and Yoshihiro Daimon (Nagaokakyo, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A radio frequency module includes a first module substrate that has a first main surface facing a second main surface, a second module substrate that has a third main surface facing a fourth main surface. The third main surface faces the second main surface. Multip...