US Patent Issued to MURATA MANUFACTURING on Jan. 20 for "Radio frequency module and communication device" (Japanese Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,531,586, issued on Jan. 20, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan).

"Radio frequency module and communication device" was invented by Takanori Uejima (Kyoto, Japan) and Hiromichi Kitajima (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A radio frequency module includes a module substrate having a first principal surface and a second principal surface, a resin member covering the first principal surface and side surfaces of first and second components disposed on the first principal surface, a metal shield layer covering an upper surface of the resin member, a metal shield wall disposed on the first principal surface, a...