US Patent Issued to MURATA MANUFACTURING on Jan. 20 for "High frequency module and communication apparatus" (Japanese Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,531,543, issued on Jan. 20, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan).

"High frequency module and communication apparatus" was invented by Dai Nakagawa (Kyoto, Japan), Takanori Uejima (Kyoto, Japan), Yuji Takematsu (Kyoto, Japan), Naoya Matsumoto (Kyoto, Japan), Ryohei Okabe (Kyoto, Japan) and Hiromichi Kitajima (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Heat dissipating characteristics of an acoustic wave filter is improved. A high frequency module includes a mounting substrate, an acoustic wave filter, a resin layer, and a shield layer. The mounting substrate has a first main surface and a second main surface that ...