US Patent Issued to MURATA MANUFACTURING on Feb. 24 for "Multilayer substrate and method of manufacturing multilayer substrate" (Japanese Inventor)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,563,677, issued on Feb. 24, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan).

"Multilayer substrate and method of manufacturing multilayer substrate" was invented by Yusuke Kamitsubo (Nagaokakyo, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A multilayer substrate includes insulating base materials stacked in a stacking direction, at least one conductor pattern on at least one of the insulating base materials, the at least one conductor pattern including two opposite major surfaces, and insulating protective films on both of the two opposite major surfaces of the at least one conductor pattern."

The patent was filed on Jan. 14, 2022,...