US Patent Issued to MURATA MANUFACTURING on Feb. 17 for "Package structure and method for manufacturing the same" (Japanese Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,552,662, issued on Feb. 17, was assigned to MURATA MANUFACTURING Co. LTD. (Nagaokakyo, Japan).

"Package structure and method for manufacturing the same" was invented by Yoshiyuki Higuchi (Nagaokakyo, Japan) and Masakazu Fukumitsu (Nagaokakyo, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure that includes a pair of substrates arranged to oppose each other so as to form an internal space; a bonding portion sealing the pair of substrates; an element is sealed in the internal space and surrounded by the pair of substrates; an adsorption layer within the internal space and opposing at least one substrate of the pair of substrates, the...