US Patent Issued to MURATA MANUFACTURING on Dec. 23 for "Resin film with conductor layer, multilayer substrate, and method for producing resin film with conductor layer" (Japanese Inventors)

ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,507,340, issued on Dec. 23, was assigned to MURATA MANUFACTURING Co. LTD. (Nagaokakyo, Japan).

"Resin film with conductor layer, multilayer substrate, and method for producing resin film with conductor layer" was invented by Mineto Mitsuhashi (Nagaokakyo, Japan), Takeshi Eda (Nagaokakyo, Japan) and Taichi Furukawa (Nagaokakyo, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A laminate structure that includes: a resin film containing a thermoplastic resin and having a plurality of voids; and a conductor layer adjacent to a main surface of the resin film, wherein a first set of voids of the plurality of voids are localized between a first position pr...