US Patent Issued to MURATA MANUFACTURING on Aug. 26 for "Electronic component comprising a 3D capacitive structure" (French Inventors)

ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,402,333, issued on Aug. 26, was assigned to MURATA MANUFACTURING Co. LTD. (Nagaokakyo, Japan).

"Electronic component comprising a 3D capacitive structure" was invented by Larry Buffle (Grenoble, France) and Frederic Voiron (Barraux, France).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic component comprising a 3D capacitive structure includes a substrate having a contoured surface comprising a plurality of wells extending from the surface into the substrate body, a dielectric formed over, and conforming to the shape of, the contoured surface, and a first electrode formed over the dielectric and conforming to the contoured surface shape. The ...