US Patent Issued to MURATA MANUFACTURING on Aug. 25 for "Multilayer substrate, electronic apparatus, and method for manufacturing multilayer substrate" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,669, issued on Aug. 25, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan).

"Multilayer substrate, electronic apparatus, and method for manufacturing multilayer substrate" was invented by Nobuo Ikemoto (Nagaokakyo, Japan), Noriaki Okuda (Nagaokakyo, Japan) and Kosuke Nishio (Nagaokakyo, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A multilayer substrate includes a multilayer body including insulation layers stacked on top of one another in an up-and-down direction. The insulation layers include a porous insulation layer. The multilayer substrate includes a first region and a second region. A dimension of the porous insulation layer...