US Patent Issued to MPI on Oct. 20 for "Adhered multilayer die unit and probe head, probe seat, probe card and test system including the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,768,861, issued on Oct. 20, was assigned to MPI Corp. (Chu-Pei City, Taiwan).

"Adhered multilayer die unit and probe head, probe seat, probe card and test system including the same" was invented by Sheng-Yu Lin (Chu-Pei City, Taiwan), Shang-Jung Hsieh (Chu-Pei City, Taiwan), Che-Wei Lin (Chu-Pei City, Taiwan) and Hsueh-Chih Wu (Chu-Pei City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An adhered multilayer die unit includes at least one probe zone and at least one non-probe zone for probes to be inserted in the probe zone. The adhered multilayer die unit includes dies and at least one adhesive layer. Each die includes at least one connecting s...