ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,782,388, issued on Nov. 3, was assigned to MPI Corp. (Chu-Pei City, Taiwan).
"Contact probe and contacting member thereof, method of manufacturing contacting member, probe system using the contacting member, method of testing unpackaged semiconductor device, tested semiconductor device and method of producing the same" was invented by Cheng-Nien Su (Chu-Pei City, Taiwan), Chung-Chi Lin (Chu-Pei City, Taiwan), Ching-Hua Wu (Chu-Pei City, Taiwan) and Hsien-Ta Hsu (Chu-Pei City, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A contacting member of a contact probe for a probe system for performing a functionality test to a DUT includes a body, a conta...