US Patent Issued to MORIROKU on Aug. 25 for "Resin-molded article" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,715,373, issued on Aug. 25, was assigned to MORIROKU Co. LTD. (Tokyo).

"Resin-molded article" was invented by Mitsuru Suzuki (Tokyo) and Takashi Tanaka (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A resin-molded article is configured so that a body having a design surface and a clip attachment member which is formed on a back surface of the design surface of the body and to which a clip is attachable, the body and the clip attachment member being integrally formed. The clip attachment member includes an attachment wall raised from the back surface, and a rib extending from the attachment wall to the back surface and reinforcing the attachment w...