US Patent Issued to Monolithic 3D on May 12 for "3D semiconductor device and structure including power distribution grids" (American, Israeli Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,430, issued on May 12, was assigned to Monolithic 3D Inc. (Allen, Texas).

"3D semiconductor device and structure including power distribution grids" was invented by Zvi Or-Bach (Haifa, Israel), Brian Cronquist (Klamath Falls, Ore.) and Deepak Sekar (Sunnyvale, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A 3D device includes a first level including a first single crystal layer with control circuitry which includes first single crystal transistors; a first metal layer atop first single crystal layer; a second, third, and fourth metal layer providing connections between the first transistors; at least one second level (includes a plurality of ...