US Patent Issued to Monolithic 3D on June 23 for "3D semiconductor devices and structures with logic and memory, and a semiconductor die" (American, Israeli Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,619, issued on June 23, was assigned to Monolithic 3D Inc. (Allen, Texas).

"3D semiconductor devices and structures with logic and memory, and a semiconductor die" was invented by Zvi Or-Bach (Haifa, Israel) and Jin-Woo Han (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A 3D semiconductor device including: a first level including a single-crystal layer, a memory control-circuit including first transistors, a first metal layer, a second metal layer, a third metal layer; connection of the first transistors includes the first, and/or the second, and/or the third metal layer; a fourth metal layer disposed atop third transistors dispose...