US Patent Issued to Monolithic 3D on Feb. 24 for "3D semiconductor devices and structures with electronic circuit units" (American, Israeli Inventors)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,563,752, issued on Feb. 24, was assigned to Monolithic 3D Inc. (Klamath Falls, Ore.).

"3D semiconductor devices and structures with electronic circuit units" was invented by Zvi Or-Bach (Haifa, Israel), Jin-Woo Han (San Jose, Calif.) and Brian Cronquist (Klamath Falls, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A 3D device including: a first level including first transistors and a first interconnect; a second level including second transistors, the second level overlaying the first level; and at least four electronic circuit units (ECUs), where each of the ECUs include a first circuit, the first circuit including a portion of the first transist...