US Patent Issued to Monolithic 3D on Dec. 16 for "3D semiconductor device and structure with logic circuits, memory cells, and processor array" (American, Israeli Inventors)

ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,501,630, issued on Dec. 16, was assigned to Monolithic 3D Inc. (Allen, Texas).

"3D semiconductor device and structure with logic circuits, memory cells, and processor array" was invented by Zvi Or-Bach (Haifa, Israel), Jin-Woo Han (San Jose, Calif.) and Brian Cronquist (Klamath Falls, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated semiconductor device including: a first level; a second level, where the first level includes single crystal silicon and a plurality of logic circuits, where the plurality of logic circuits each include first transistors, where the second level is disposed above the first level and includes a plurality of ar...