US Patent Issued to MITSUI MINING & SMELTING on Aug. 26 for "Method for measuring surface parameter of copper foil, and method for sorting copper foil" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,399,001, issued on Aug. 26, was assigned to MITSUI MINING & SMELTING Co. LTD. (Tokyo).

"Method for measuring surface parameter of copper foil, and method for sorting copper foil" was invented by Hiroaki Kurihara (Ageo, Japan) and Takeshi Iwase (Ageo, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A measurement method capable of acquiring, in a simple manner, a surface parameter of copper foil exhibiting high correlation with high frequency characteristics, the method including: (a) acquiring a surface profile of surface-treated copper foil as a reference; (b) setting a cutoff value for an L filter, the cutoff value satisfies: (i) an arithmetical m...