US Patent Issued to MITSUI KINZOKU on Aug. 4 for "Wiring substrate, method of trimming same, and multi-layered wiring board" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,662, issued on Aug. 4, was assigned to MITSUI KINZOKU COMPANY Ltd. (Tokyo).

"Wiring substrate, method of trimming same, and multi-layered wiring board" was invented by Toshimi Nakamura (Ageo, Japan), Mikiko Komiya (Ageo, Japan) and Yoshinori Matsuura (Ageo, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided a wiring substrate whose mechanical strength, water resistance, humidity resistance, and product yield can be improved. This wiring substrate includes a device region in which a main wiring pattern composed of a metal layer is embedded in an insulating layer; a peripheral region which surrounds a periphery of the device region ...