US Patent Issued to Mitsubishi Materials on Feb. 24 for "Metal sheet material, layered body, insulated circuit board, and metal sheet material manufacturing method" (Japanese Inventors)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,563,666, issued on Feb. 24, was assigned to Mitsubishi Materials Corp. (Tokyo).

"Metal sheet material, layered body, insulated circuit board, and metal sheet material manufacturing method" was invented by Marina Sakamaki (Saitama, Japan), Kenji Kubota (Naka, Japan) and Toyo Ohashi (Saitama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "This metal sheet material is made of copper or a copper alloy, and includes a main sheet body and a roughened plating layer that is formed on an outermost surface layer of the main sheet body. An engagement protrusion that protrudes toward the opposite side to the main sheet body and has a widening portion that gra...