US Patent Issued to MITSUBISHI HEAVY INDUSTRIES MACHINE TOOL, TECHNOLOGY RESEARCH ASSOCIATION FOR FUTURE ADDITIVE MANUFACTURING on Sept. 9 for "Three-dimensional deposition device and method" (Japanese Inventor)

ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,409,497, issued on Sept. 9, was assigned to MITSUBISHI HEAVY INDUSTRIES MACHINE TOOL Co. LTD. (Ritto, Japan) and TECHNOLOGY RESEARCH ASSOCIATION FOR FUTURE ADDITIVE MANUFACTURING (Tokyo).

"Three-dimensional deposition device and method" was invented by Tomohiro Wakana (Shiga, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "In the three-dimensional deposition device and the three-dimensional deposition method, included are: a powder passage and a nozzle injection opening serving as a powder supply unit that supplies powder toward an object to be processed; a laser path serving as a light irradiation unit that irradiates the powder with a laser beam...