US Patent Issued to MITSUBISHI HEAVY INDUSTRIES, MITSUBISHI HEAVY INDUSTRIES MACHINERY SYSTEMS on June 2 for "Panel structure manufacturing device and panel structure manufacturing method" (Japanese Inventors)

ALEXANDRIA, Va., June 2 -- United States Patent no. 12,644,282, issued on June 2, was assigned to MITSUBISHI HEAVY INDUSTRIES LTD. (Tokyo) and MITSUBISHI HEAVY INDUSTRIES MACHINERY SYSTEMS LTD. (Hyogo, Japan).

"Panel structure manufacturing device and panel structure manufacturing method" was invented by Takayuki Koyama (Tokyo), Kiyoka Takagi (Tokyo), Katsuya Sennyu (Hyogo, Japan), Yoshinao Takakuwa (Hyogo, Japan), Takayuki Miyake (Hyogo, Japan) and Katsuhide Aikawa (Hyogo, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A panel structure manufacturing device includes a shaping device that shapes the surface of a thermoplastic resin into a relief shape and forms a plate-like core member; a heating devic...