US Patent Issued to MITSUBISHI HEAVY INDUSTRIES, AKITA UNIVERSITY on Aug. 25 for "Composite material forming device and composite material forming method" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,715,179, issued on Aug. 25, was assigned to MITSUBISHI HEAVY INDUSTRIES LTD. (Tokyo) and AKITA UNIVERSITY (Akita, Japan).

"Composite material forming device and composite material forming method" was invented by Nobuyuki Kamihara (Tokyo), Sota Kamo (Tokyo), Kiyoka Takagi (Tokyo), Naomoto Ishikawa (Tokyo), Mikio Muraoka (Akita, Japan) and Yukihiro Yoshida (Akita, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A composite material forming device forms a composite material including a resin and reinforced fibers having electrical conductivity. The composite material forming device includes: a conduction jig having electrical conductivity, the conduct...