US Patent Issued to MITSUBISHI GAS CHEMICAL on Sept. 16 for "Epoxy resin composition, gas barrier multilayer body, retort food packaging material, packaging material for deodorization or aroma retention, heat shrinkable label and method for producing same, heat shrunk label and bottle having same" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,415,347, issued on Sept. 16, was assigned to MITSUBISHI GAS CHEMICAL COMPANY INC. (Tokyo).

"Epoxy resin composition, gas barrier multilayer body, retort food packaging material, packaging material for deodorization or aroma retention, heat shrinkable label and method for producing same, heat shrunk label and bottle having same" was invented by Kazuki Kouno (Kanagawa, Japan), Ryoma Hashimoto (Kanagawa, Japan) and Naoko Kobayashi (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An epoxy resin composition including an epoxy resin, an epoxy resin curing agent containing an amine-based curing agent, and an unsaturated fatty acid amide having ...