ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,412,813, issued on Sept. 9, was assigned to Mitsubishi Electric Corp. (Tokyo).
"Semiconductor module" was invented by Kensuke Takeuchi (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure includes: a base plate having a shape of a sheet; a relay plate having a shape of a sheet; a terminal member; and an electronic component joined to one surface of the base plate. The base plate, the relay plate, and the terminal member are electrically conductive members and arranged on a same plane with gaps between the electrically conductive members. The electronic component and one surface of the relay plate are connected to each other by a...