ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,752,369, issued on Oct. 6, was assigned to MITSUBISHI ELECTRIC Corp. (Tokyo).

"Laser machining apparatus" was invented by Kyohei Ishikawa (Tokyo), Masaki Seguchi (Tokyo), Motoaki Nishiwaki (Tokyo), Kenta Fujii (Tokyo) and Tomotaka Katsura (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A laser machining apparatus includes an actuator that changes relative positions of a machining head and a workpiece; a control unit that controls in machining execution the laser oscillator, the machining head, and the actuator based on a machining parameter; a machining state observation unit that detects, from process light that is light generated from the workpie...