US Patent Issued to Mitsubishi Electric on July 21 for "Heat pump device and hot water supply device" (Japanese Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,687,332, issued on July 21, was assigned to Mitsubishi Electric Corp. (Tokyo).

"Heat pump device and hot water supply device" was invented by Kimitaka Kadowaki (Tokyo), Yota Maema (Tokyo), Masahiro Ito (Tokyo), Shunya Gyotoku (Tokyo), Kosuke Kawano (Tokyo) and Akinori Kurachi (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a main refrigerant circuit in which a compressor having an injection port, a condenser, a main circuit expansion device unit, and an evaporator are connected by pipes to allow refrigerant to circulate in the main refrigerant circuit; an injection pipe an injection expansion device; an outside-air temperature detectio...