ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,564,072, issued on Feb. 24, was assigned to Mitsubishi Electric Corp. (Tokyo).
"Semiconductor device and method for manufacturing the same" was invented by Atsushi Urata (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device according to the present disclosure includes: a lead frame having a plurality of die pad portions electrically independent from each other; a power semiconductor element provided on each of the die pad portions; a wire electrically connecting the power semiconductor element and the lead frame; an epoxy-based resin provided on at least a part of the lead frame; and a sealing resin covering at least each of the d...