ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,715, issued on Feb. 17, was assigned to Mitsubishi Electric Corp. (Tokyo).
"Semiconductor device" was invented by Yuya Omagari (Tokyo) and Shuhei Yokoyama (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a power semiconductor element, and a molding resin sealing the power semiconductor element. In plan view, the molding resin has a rectangular shape consisting of a first side and a second side extending along a first direction, and a third side and a fourth side extending along a second direction orthogonal to the first direction. The first side is longer than the third side. The molding resin is provided with a ...