ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,755, issued on Feb. 10, was assigned to Mitsubishi Electric Corp. (Tokyo).
"Hollow package" was invented by Koji Misaki (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A hollow package includes a device substrate; a lid substrate provided above the device substrate; a first sealing ring provided on an upper surface of the device substrate; a second sealing ring provided on a lower surface of the lid substrate so as to face the first sealing ring; a seal layer that bonds the first sealing ring and the second sealing ring; and a functional element provided in a hollow portion surrounded by the device substrate, the lid substrate, the first seali...