US Patent Issued to Mitsubishi Electric on Dec. 2 for "Manufacturing method of insert case for semiconductor device and semiconductor device" (Japanese Inventor)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,488,995, issued on Dec. 2, was assigned to Mitsubishi Electric Corp. (Tokyo).

"Manufacturing method of insert case for semiconductor device and semiconductor device" was invented by Hiroyuki Masumoto (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A manufacturing method of an insert case for a semiconductor device includes: placing a terminal inside a mold and fixing a central portion of the terminal by bringing a slide core into contact with the central portion of the terminal; with the central portion of the terminal fixed by the slide core, filling an inside of the mold with resin to mold an insert case; and separating the slide core from the te...