US Patent Issued to Mitsubishi Electric on Aug. 4 for "Semiconductor power module" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,999, issued on Aug. 4, was assigned to Mitsubishi Electric Corp. (Tokyo).

"Semiconductor power module" was invented by Katsushi Nakada (Tokyo) and Yoshitaka Miyaji (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a semiconductor power module in which an electric field at corners of electrodes and around the corners is reduced while size reduction and voltage increase are achieved. The semiconductor power module includes a plurality of electrodes having different potentials and laid over each other with an interval therebetween. As seen in a direction in which the plurality of electrodes are laid over each other, each of the plurality...