US Patent Issued to Mitsubishi Electric on Aug. 18 for "Semiconductor device module and method for manufacturing same" (Japanese Inventor)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,923, issued on Aug. 18, was assigned to Mitsubishi Electric Corp. (Tokyo).

"Semiconductor device module and method for manufacturing same" was invented by Shunichi Abe (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device module includes a device mounted on the surface of an organic substrate; a heat dissipation block bonded and fixed to the surfaces of the device; and a molded resin sealing the device with at least one surface of the heat dissipation block being exposed. The heat dissipation block includes a first portion and a second portion made of materials different in hardness: the first portion is harder than the second...