US Patent Issued to Mitsubishi Electric on Aug. 11 for "Power conversion device with overlapping solid wiring patterns" (Japanese Inventor)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,706,528, issued on Aug. 11, was assigned to Mitsubishi Electric Corp. (Chiyoda-ku, Japan).

"Power conversion device with overlapping solid wiring patterns" was invented by Ryoma Hayashi (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A power conversion device includes a first solid pattern provided on a multi-layer wiring substrate and connected to a positive side of a first power supply, a second solid pattern provided on the multi-layer wiring substrate and connected to a negative side of the first power supply, and a third solid pattern provided on the multi-layer wiring substrate and connected to a negative side of a second power supply that i...