ALEXANDRIA, Va., July 28 -- United States Patent no. 12,692,342, issued on July 28, was assigned to Mitsubishi Chemical Corp. (Tokyo).

"Epoxy resin composition, cured product, and electrical/electronic component" was invented by Kazumasa Ota (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "An epoxy resin composition (A), having an epoxy resin represented by formula (1):and an epoxy resin represented by formula (2):where R1 is a linear aliphatic hydrocarbon group having 1 to 6 carbon atoms, and n is an integer of 0 or 1. An epoxy resin composition (B), having 100 parts by weight of the epoxy resin composition (A) and 0.01 to 1,000 parts by weight of a curing agent."

The patent was filed on Aug. 25, 2022...