US Patent Issued to Mitsubishi Chemical on July 14 for "Resin composition, molded object, modifier for polyamide resin, and method for modifying polyamide resin" (Japanese Inventor)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,679,972, issued on July 14, was assigned to Mitsubishi Chemical Corp. (Tokyo).

"Resin composition, molded object, modifier for polyamide resin, and method for modifying polyamide resin" was invented by Takuya Ito (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "The resin composition of the present disclosure contains a polyamide resin (A) and a modified ethylene-vinyl alcohol resin (B) grafted with an aliphatic polyester, wherein the content of the modified ethylene-vinyl alcohol resin is 1 part by weight or more and less than 50 parts by weight, when the total content of the polyamide resin (A) and the modified ethylene-vinyl alcohol resin (B) is ...