US Patent Issued to MITSUBISHI CHEMICAL, GELEST on March 17 for "Manufacturing method of patterning substrate, patterned substrate, and intermediate patterned substrate" (Japanese Inventor)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,581,710, issued on March 17, was assigned to MITSUBISHI CHEMICAL Corp. (Tokyo) and GELEST INC. (Morrisville, Pa.).

"Manufacturing method of patterning substrate, patterned substrate, and intermediate patterned substrate" was invented by Hiroshi Fukui (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "An excellent method of manufacturing a patterned substrate which is capable of easily patterning an insulation layer to provide a patterned substrate even when a difficult-to-etch material is used for the insulation layer, a patterned substrate obtained thereby, and a patterned substrate intermediate thereof are provided. The method of manufacturing a p...