US Patent Issued to MITSUBISHI CHEMICAL, GELEST on Aug. 25 for "Bonding structure, metal gasket or metal o-ring used therein, and container, pipe, and organotin compound manufacturing apparatus having the same" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,716,492, issued on Aug. 25, was assigned to MITSUBISHI CHEMICAL Corp. (Tokyo) and GELEST INC. (Morrisville, Pa.).

"Bonding structure, metal gasket or metal o-ring used therein, and container, pipe, and organotin compound manufacturing apparatus having the same" was invented by Hisatoshi Uehara (Tokyo) and Hiroshi Fukui (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A bonding structure used for forming a sealed space (for example, a container) for containing or transferring an organotin compound, wherein the bonding structure is a structure in which a first metal member (for example, a lid of the container) is connected to a second metal member (f...