US Patent Issued to MITSUBISHI CABLE INDUSTRIES on March 24 for "Semiconductor production device sealing material" (Japanese Inventors)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,584,054, issued on March 24, was assigned to MITSUBISHI CABLE INDUSTRIES LTD. (Tokyo).

"Semiconductor production device sealing material" was invented by Hiroaki Yasuda (Amagasaki, Japan), Takehiro Hamamura (Tokyo) and Takao Ito (Amagasaki, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A seal material for a semiconductor manufacturing device is made of a rubber composition containing fluororubber and phenol resin powder. The content of the phenol resin powder is 1 part by mass or more and 50 parts by mass or less with respect to 100 parts by mass of the fluororubber. The average particle size of the phenol resin powder is 1 micro metre or more a...