ALEXANDRIA, Va., July 16 -- United States Patent no. 12,667,360, issued on June 30, was assigned to MicroVention Inc. (Aliso Viejo, Calif.).
"Implant delivery system with multiple detachment mechanisms" was invented by Hussain Rangwala (Villa Park, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A detachment system for an implant is described having a first detachment mechanism and a second detachment mechanism. Either or both of the first or second detachment system may be activated by the user depending on certain conditions or if one of the detachment mechanism fails."
The patent was filed on March 18, 2022, under Application No. 18/550,656.
*For further information, including images, charts and t...