ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,749,699, issued on Sept. 29, was assigned to MICROVAST INC. (Stafford, Texas).
"Pressure bonding device" was invented by Weifeng Fang (Huzhou, China) and Wenjuan Liu Mattis (Longwood, Fla.).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention provides a pressure bonding device including a base, a sealing cover, and a pressurizing assembly. The base is used to place a to-be-pressed member; the sealing cover is used to cooperate with the base to form a sealing space between the base and the sealing cover during pressure bonding operation; the pressurizing assembly is connected to the sealing cover, and the pressurizing assembly is used to ...