US Patent Issued to Micron Technology on Sept. 9 for "Electronic systems including two-dimensional material structures" (Idaho Inventors)

ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,412,745, issued on Sept. 9, was assigned to Micron Technology Inc. (Boise, Idaho).

"Electronic systems including two-dimensional material structures" was invented by Roy E. Meade (Boise, Idaho) and Sumeet C. Pandey (Boise, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of forming a semiconductor device structure comprises forming at least one 2D material over a substrate. The at least one 2D material is treated with at least one laser beam having a frequency of electromagnetic radiation corresponding to a resonant frequency of crystalline defects within the at least one 2D material to selectively energize and remove the crystalline defec...