US Patent Issued to Micron Technology on Sept. 29 for "Semiconductor devices with wrap-around arrays" (Idaho Inventor)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,749,518, issued on Sept. 29, was assigned to Micron Technology Inc. (Boise, Idaho).

"Semiconductor devices with wrap-around arrays" was invented by Sujeet Ayyapureddi (Boise, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device is presented. The semiconductor device includes a first memory mat associated with a first memory array segment and a first portion of a second memory array segment, a second memory mat disposed adjacent to the first memory mat, the second memory mat associated with a second portion of the second memory array segment and a first portion of a third memory array segment, and a third memory mat disposed adjac...