US Patent Issued to Micron Technology on Sept. 15 for "Cycling replacement blocks based on a die wafer location" (Singaporean, American Inventors)

ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,738,341, issued on Sept. 15, was assigned to Micron Technology Inc. (Boise, Idaho).

"Cycling replacement blocks based on a die wafer location" was invented by Tawalin Opastrakoon (Boise, Idaho), Sean Brasfield (Boise, Idaho) and Chonggiap Chiew (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "A technique is disclosed for cycling replacement blocks based on die wafer location data. The die wafer location data can provide a die location failure value for each die of a memory device. Each die location failure value can indicate a likelihood of die failure during operation of the memory device. A die of the memory device can be identified as a hig...