US Patent Issued to Micron Technology on Oct. 6 for "Staircase structures for accessing three-dimensional memory arrays" (Idaho Inventors)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,703, issued on Oct. 6, was assigned to Micron Technology Inc. (Boise, Idaho).

"Staircase structures for accessing three-dimensional memory arrays" was invented by Collin Howder (Boise, Idaho), Martin Jared Barclay (Middleton, Idaho), Harsh Narendrakumar Jain (Boise, Idaho) and Yiping Wang (Boise, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "Methods, systems, and devices for staircase structures for accessing three-dimensional (3D) memory arrays are described. A memory system may include an access region (e.g., a staircase region) that includes circuitry for accessing memory cells at respective levels of memory cells. The access region may inc...