US Patent Issued to Micron Technology on Oct. 20 for "Device cooling enclosure and adapter for housing devices of different widths" (California Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,768,878, issued on Oct. 20, was assigned to Micron Technology Inc. (Boise, Idaho).

"Device cooling enclosure and adapter for housing devices of different widths" was invented by Brad Emberger (San Jose, Calif.), Justin Glasgow (San Jose, Calif.) and Kapil Ayyawar (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments of the present invention provide a DUT air duct shroud that can receive and house DUTs of a specific form factor, and can advantageously be adapted to house and cool DUTs of a different (e.g., narrower) form factor. The DUT shrouds described herein guide the DUT into the correct position and orientation to be received ...