US Patent Issued to Micron Technology on Nov. 3 for "Molded memory assemblies for a system in package semiconductor device assembly" (Singaporean Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,853, issued on Nov. 3, was assigned to Micron Technology Inc. (Boise, Idaho).

"Molded memory assemblies for a system in package semiconductor device assembly" was invented by Wen Wei Lum (Singapore), Kelvin Aik Boo Tan (Singapore) and Seng Kim Ye (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "Implementations described herein relate to various semiconductor device assemblies. In some implementations, a molded memory device may include multiple stacked NAND dies electrically coupled to one another via multiple wire bonds. The molded memory device may include a molded casing surrounding the multiple stacked NAND dies and encapsulating the mul...