US Patent Issued to Micron Technology on May 12 for "Microelectronic device package assemblies including stiffener devices, and related microelectronic devices and electronic systems" (Singaporean, American, Indian Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,267, issued on May 12, was assigned to Micron Technology Inc. (Boise, Idaho).

"Microelectronic device package assemblies including stiffener devices, and related microelectronic devices and electronic systems" was invented by Prasad Nagavenkata Nune (Hyderabad, India), Christopher Glancey (Boise, Idaho), Yeow Chon Ong (Singapore) and Hong Wan Ng (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "A microelectronic device package assembly includes a package board and a stiffener device attached to the package board. The package board has a first side and a second side. The stiffener device includes an upper stiffener, a lower stiffener, and one ...